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HARVARD Citation
Wang, P. et al. (2017). A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC. Materials science in semiconductor processing. pp. 21-29. [Online].
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Wang, P. et al. (2017). A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC. Materials science in semiconductor processing. pp. 21-29. [Online].