Bifurcation in deformation behavior of Cu and Ta by accumulative roll-bonding at high temperature. (15th July 2017)

• Record Type: Journal Article
• Authors: Mungole, Tarang; Mansoor, Bilal; Ayoub, Georges; Field, David P.
• Is Part Of: Scripta materialia. Number 136(2017)
• Page Start: 87
• Page End: 91
• Publication Date: 2017-07-15
• Subjects: Accumulative roll bonding -- Co-deformation -- Multilayers -- High-temperature deformation -- Interfaces; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2017.04.012
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract: Cu and Ta are co-deformed at 673 K by the accumulative roll-bonding technique up to 8 passes. At an equivalent von Mises strain ( ɛ vm ) of ~ 2 the deformation is bifurcated into shear accommodated by the 'soft' Cu, and plane-strain by the 'hard-but-ductile' Ta. This is attributed to transitions occurring collectively at ɛ vm ~ 2 in crystallographic texture, partitioning of recovery and recrystallization, and the nature of interfaces as elucidated by orientation relations, Hall-Petch behavior and manifestation of instabilities at higher strain. Graphical abstract: