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HARVARD Citation
Bigl, S. et al. (2017). Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue. Journal of materials research. 32 (11), pp. 2022-2034. [Online].
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Bigl, S. et al. (2017). Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue. Journal of materials research. 32 (11), pp. 2022-2034. [Online].