P‐183: Study of Electrical Probing through Thin‐film Encapsulation Made of Al2O3 Films Deposited by Low Temperature ALD onto Different Metallic Underlayers. Issue 1 (May 2017)

• Record Type: Journal Article
• Authors: Maindron, Tony; Troc, Nicolas; Aventurier, Bernard; Mandrillon, Vincent; Delaye, Vincent; Vandeneynde, Aurelie
• Is Part Of: Digest of technical papers. Volume 48:Issue 1(2017)
• Page Start: 1960
• Page End: 1962
• Publication Date: 2017-05
• Subjects: Organic electronics -- OLED -- thin-film encapsulation -- electrical probing -- contact pads -- ALD; Information display systems -- Congresses; 621.3815422
• DOI: 10.1002/sdtp.12025
• Languages: English
• ISSNs: 0097-966X

Abstract

Abstract : A qualitative study of electrical probing through 25 nm thick amorphous Al2 O3 barrier layers, made by low temperature ALD, has been developed. It has been found that the effectiveness of probing depends on the metallic layer beneath the oxide barrier. While a 100 nm thick Cr layer does not allow any probing through the oxide, softer metals like Al turn out to be ideal candidates. From a mechanical point‐of‐view, nano‐indentation studies (normal nano‐indentation with a Berkovitch indenter) onto Al2 O3 films made onto the different metals reveal that their mechanical properties are different. While Al2 O3 onto Cr is very stiff, Al2 O3 deposited onto Al is softer, allowing electrical probes to reach the metal underneath.