Heat spreader with parallel microchannel configurations employing nanofluids for near–active cooling of MEMS. (August 2017)

• Record Type: Journal Article
• Authors: Maganti, Lakshmi Sirisha; Dhar, Purbarun; Sundararajan, T.; Das, Sarit Kumar
• Is Part Of: International journal of heat and mass transfer. Volume 111(2017)
• Page Start: 570
• Page End: 581
• Publication Date: 2017-08
• Subjects: Heat -- Transmission -- Periodicals; Mass transfer -- Periodicals; Chaleur -- Transmission -- Périodiques; Transfert de masse -- Périodiques; Electronic journals; 621.4022
• DOI: 10.1016/j.ijheatmasstransfer.2017.04.032
• Languages: English
• ISSNs: 0017-9310

Abstract

Highlights: The concept of near active cooing of microprocessor proposed experimentally. Thermohydraulic performance of variant nanofluids in PMCS analysed. IR thermography shows nanofluids to reduce hot spot occurrence as well as uniform cooling. Figure of Merit proposed to quantify the thermal performance of configuration-fluid pair. Z configuration with nanofluid proven as best pair for cooling microprocessors. Abstract: While parallel microchannel based cooling systems (PMCS) have been around for quite a period of time, employing the same and incorporating them for near–active cooling of microelectronic devices is yet to be implemented and the implications of the same on thermal mitigation to be understood. The present article focusses on a specific design of the PMCS such that it can be implemented at ease on the heat spreader of a modern microprocessor to obtain near-active cooling. Extensive experimental and numerical studies have been carried out to comprehend the same and three different flow configurations (U, I and Z) of PMCS have been adopted for the present investigations. Additional to focussing on the thermofluidics due to flow configuration, nanofluids (as superior heat transfer fluids) have also been employed to achieve the desired essentials of mitigation of overshoot temperatures and improving uniformity of cooling. Two modelling methods, Discrete Phase Modelling (DPM) and Effective Property Modelling (EPM) have been employed for numerical study to model nanofluids as working fluid in micro flow paths and the DPM predictions have been observed to match accurately with experiments. To quantify the thermal performance of PMCS, an appropriate Figure of Merit (FoM) has been proposed. From the FoM It has been perceived that the Z configuration employing nanofluid is the best suitable solutions for uniform thermal loads to achieve uniform cooling as well as reducing maximum temperature produced with in the device. The present results are very promising and viable approach for futuristic thermal mitigation of microprocessor systems.