Trapping mechanisms in insulated‐gate GaN power devices: Understanding and characterization techniques. Issue 3 (16th January 2017)

• Record Type: Journal Article
• Authors: Yang, Shu; Liu, Shenghou; Lu, Yunyou; Chen, Kevin J.
• Is Part Of: Physica status solidi. Volume 214:Issue 3(2017)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2017-01-16
• Subjects: dynamic stress -- GaN -- interface/border traps -- ON‐resistance -- power devices -- reliability; Solid state physics -- Periodicals; Solids -- Industrial applications -- Periodicals; 530.41
• DOI: 10.1002/pssa.201600607
• Languages: English
• ISSNs: 1862-6300

Abstract

Abstract : In addition to surface‐ and buffer‐trapping, interface/border trapping and the consequent V TH shift in insulated‐gate GaN power transistors could also cause R ON increase, due to the reduced gate overdrive. This work reports on a systematic study of the trapping mechanisms in normally‐on/off insulated‐gate GaN transistors subjected to dynamic (AC) and static (DC) gate stress. The fast dynamic characterizations featuring an ultrashort measurement delay of 10 −7 s minimize the recovery during measurement and enable a quantitative evaluation of V TH shift‐induced R ON increase. By analyzing the time‐resolved instability in normally‐on MIS‐HEMT and normally‐off MIS‐FET with fully recessed barrier, we elucidate several key mechanisms including: (i) recessing the polarized III‐nitride barrier layer can suppress V TH shift during ON/OFF switching; (ii) AC stress, which has more practical implication for lifetime projection for power switching applications, produces smaller V TH shift and R ON increase comparing to DC stress; (iii) Sufficient gate overdrive at ON state and lower channel resistance in normally‐on MIS‐HEMT allow a better tolerance to V TH shift. Primary trapping effects in an insulated‐gate GaN power transistor.