Electrical–thermal modeling of through‐silicon via (TSV) arrays in interposer. (25th September 2012)

• Record Type: Journal Article
• Authors: Xie, Jianyong; Xie, Biancun; Swaminathan, Madhavan
• Other Names: Yin Wei Yan guestEditor.; Weile Daniel S. guestEditor.
• Is Part Of: International journal of numerical modelling. Volume 26:Number 6(2013:Nov./Dec.)
• Page Start: 545
• Page End: 559
• Publication Date: 2012-09-25
• Subjects: cascadic multigrid method (CMG) -- through‐silicon via (TSV) -- thermal effect -- cylindrical modal basis function; Electric networks -- Mathematical models -- Periodicals; Electronics -- Mathematical models -- Periodicals; 621.3011
• DOI: 10.1002/jnm.1859
• Languages: English
• ISSNs: 0894-3370

Abstract

SUMMARY: In this paper, electrical–thermal modeling of through‐silicon via (TSV) arrays is presented. In order to address the thermal effect on TSVs, TSV array design and modeling need to take into account the effect of realistic system thermal profile to meet design budget. To obtain temperature estimation for a 3D system, cascadic multigrid method is employed using an initial guess obtained by simulation using equivalent thermal conductivity to represent critical regions. By considering the thermal effect on electrical conductivities of TSV conductor and silicon substrate, the electrical–thermal modeling of TSV array in the interposer is carried out using cylindrical modal basis functions. The temperature effect on TSV insertion loss, crosstalk, and RLCG parameters are discussed with examples along with correlation with measurements. Copyright © 2012 John Wiley & Sons, Ltd.