Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics with a Hot Spot. Issue 14 (13th October 2017)

• Record Type: Journal Article
• Authors: Reddy, Sohail R.; Abdoli, Abas; Dulikravich, George S.; Pacheco, Cesar C.; Vasquez, Genesis; Jha, Rajesh; Colaco, Marcelo J.; Orlande, Helcio R. B.
• Is Part Of: Heat transfer engineering. Volume 38:Issue 14/15(2017)
• Page Start: 1235
• Page End: 1246
• Publication Date: 2017-10-13
• Subjects: Heat -- Transmission -- Periodicals; 621.4022
• DOI: 10.1080/01457632.2016.1242953
• Languages: English
• ISSNs: 0145-7632

Abstract

ABSTRACT: This article presents fully three-dimensional conjugate heat transfer analysis and a multi-objective, constrained optimization to find sizes of pin-fins, inlet water pressure, and average speed for arrays of micro pin-fins used in the forced convection cooling of an integrated circuit with a uniformly heated 4 × 3 mm footprint and a centrally located 0.5 × 0.5 mm hot spot. Sizes of micro pin-fins having cross sections shaped as circles, symmetric airfoils, and symmetric convex lenses are optimized to completely remove heat due to a steady, uniform heat flux of 500 W cm −2 imposed over the entire footprint (background heat flux) and a steady, uniform heat flux of 2000 W cm −2 imposed on the hot spot area only (hot spot heat flux). The two simultaneous objectives are to minimize maximum substrate temperature and minimize pumping power, while keeping the maximum temperature constrained below 85°C and removing all of input thermal energy by convection. The design variables are the inlet average velocity and size of the pin-fins. A response surface is generated for each of the objectives and coupled with a genetic algorithm to arrive at a Pareto frontier of the best trade-off solutions. Numerical results show that, for a specified maximum temperature, optimized arrays with pin-fins having symmetric convex lens shapes create the lowest pressure drop, followed by the symmetric airfoil and circular cross-section pin-fins. An a posteriori three-dimensional stress–deformation analysis incorporating hydrodynamic and thermal loads shows that Von-Mises stress for each pin-fin array is significantly below the yield strength of silicon, thus, confirming structural integrity of such arrays of micro pin-fins.