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Chiariello, A. et al. (n.d.). Temperature effects on electrical performance of carbon‐based nano‐interconnects at chip and package level. International journal of numerical modelling. pp. 560-572. [Online].
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Chiariello, A. et al. (n.d.). Temperature effects on electrical performance of carbon‐based nano‐interconnects at chip and package level. International journal of numerical modelling. pp. 560-572. [Online].