Cite
HARVARD Citation
Tonozuka, Y. et al. (2017). Degradation Behaviors of Adhesion Strength between Epoxy Resin and Copper Under Aging at High Temperature. Procedia engineering. pp. 648-654. [Online].
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Tonozuka, Y. et al. (2017). Degradation Behaviors of Adhesion Strength between Epoxy Resin and Copper Under Aging at High Temperature. Procedia engineering. pp. 648-654. [Online].