Cite
HARVARD Citation
Tan, S. et al. (2017). Effects of twin grain boundaries on the subgrain rotation of the solder joint during thermal shock. Microelectronics and reliability. pp. 126-133. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Tan, S. et al. (2017). Effects of twin grain boundaries on the subgrain rotation of the solder joint during thermal shock. Microelectronics and reliability. pp. 126-133. [Online].