Post-plating Annealing of Light Induced Plated Copper Fingers: Implications for Reliable Metallization. (November 2016)

• Record Type: Journal Article
• Authors: Song, Ning; Hsiao, Pei-Chieh; Zhang, Wei; Wang, Xi; Colwell, Jack; Li, Zhongtian; Lennon, Alison
• Is Part Of: Energy procedia. Volume 98(2016)
• Page Start: 136
• Page End: 141
• Publication Date: 2016-11
• Subjects: Light induced plating -- Cu fingers -- Post annealing; Power resources -- Congresses; Power resources -- Periodicals; Power resources; Conference proceedings; Periodicals; 333.7905
• DOI: 10.1016/j.egypro.2017.03.1299
• Languages: English
• ISSNs: 1876-6102

Abstract

Abstract: Light-induced plating (LIP)of Ni/Cu presents a potentially lower-cost alternative to screen-printed Ag for silicon solar cell metallization. This paper presents results of self-annealing and post-plating rapid thermal processing (RTP) of plated Cu finger microstructure, texture and resistance. It is shown that the plated Cu conductors, if not thermally-annealed immediately after plating, self-anneal with time resulting in grain growth and increased (200) to (111) grain texture which occurs with increased tensile stress. Post-plating RTP annealing enables fast annealing and stable Cu fingers with a low ratio of (200) to (111) grain texture. These findings have important implications for plated finger adhesion and highlight the importance of annealing after plating for reliable Cu plated metallization.