A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems. (February 2017)
- Record Type:
- Journal Article
- Title:
- A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems. (February 2017)
- Main Title:
- A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems
- Authors:
- Nazir, M.H.
Khan, Z.A. - Abstract:
- Abstract: This paper contains a review of the most vital concepts regarding the analysis and design of film systems. Various techniques have been presented to analyse and predict the failure of films for all common types of failure: fracture, delamination, general yield, cathodic blistering, erosive and corrosive wear in both organic and inorganic films. Interfacial fracture or delamination is the loss of bonding strength of film from substrate, and is normally analysed based on the fracture mechanics concepts of bi-material systems. Therefore, keeping the focus of this review on bonding strength, the emphasis will be on the interfacial cracking of films and the corresponding stresses responsible for driving the delamination process. The bi-material characteristics of film systems make the nature of interfacial cracks as mixed mode, with cracks exhibiting various complex patterns such as telephone cord blisters. Such interfacial fracture phenomenon has been widely studied by using fracture mechanics based applicable analysis to model and predict the fracture strength of interface in film systems. The incorporation of interfacial fracture mechanics concepts with the thermodynamics/diffusion concepts further leads to the development of corrosive degradation theories of film systems such as cathodic blistering. This review presents suggestions for improvements in existing analysis techniques to overcome some of limitations in film failure modelling. This comprehensive reviewAbstract: This paper contains a review of the most vital concepts regarding the analysis and design of film systems. Various techniques have been presented to analyse and predict the failure of films for all common types of failure: fracture, delamination, general yield, cathodic blistering, erosive and corrosive wear in both organic and inorganic films. Interfacial fracture or delamination is the loss of bonding strength of film from substrate, and is normally analysed based on the fracture mechanics concepts of bi-material systems. Therefore, keeping the focus of this review on bonding strength, the emphasis will be on the interfacial cracking of films and the corresponding stresses responsible for driving the delamination process. The bi-material characteristics of film systems make the nature of interfacial cracks as mixed mode, with cracks exhibiting various complex patterns such as telephone cord blisters. Such interfacial fracture phenomenon has been widely studied by using fracture mechanics based applicable analysis to model and predict the fracture strength of interface in film systems. The incorporation of interfacial fracture mechanics concepts with the thermodynamics/diffusion concepts further leads to the development of corrosive degradation theories of film systems such as cathodic blistering. This review presents suggestions for improvements in existing analysis techniques to overcome some of limitations in film failure modelling. This comprehensive review will help researchers, scientists, and academics to understand, develop and improve the existing models and methods of film-substrate systems. Highlights: This paper contains a review of the most vital concepts regarding the analysis and design of coated and filmed surfaces. The successes and failures of modelling techniques of cracking and corrosive degradation in films have been discussed. It highlights the future scientific challenges and suggestions to improve the accuracy and reliability of existing models. … (more)
- Is Part Of:
- Engineering failure analysis. Volume 72(2017)
- Journal:
- Engineering failure analysis
- Issue:
- Volume 72(2017)
- Issue Display:
- Volume 72, Issue 2017 (2017)
- Year:
- 2017
- Volume:
- 72
- Issue:
- 2017
- Issue Sort Value:
- 2017-0072-2017-0000
- Page Start:
- 80
- Page End:
- 113
- Publication Date:
- 2017-02
- Subjects:
- Film failure -- Film cracking -- Interfacial cracking -- Corrosion -- Cathodic delamination -- Cathodic blistering -- Tribo-corrosion
System failures (Engineering) -- Periodicals
Fracture mechanics -- Periodicals
Reliability (Engineering) -- Periodicals
Pannes -- Périodiques
Rupture, Mécanique de la -- Périodiques
Fiabilité -- Périodiques
Fracture mechanics
Reliability (Engineering)
System failures (Engineering)
Periodicals
Electronic journals
620.112 - Journal URLs:
- http://www.sciencedirect.com/science/journal/13506307 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.engfailanal.2016.11.010 ↗
- Languages:
- English
- ISSNs:
- 1350-6307
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 3760.991000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 1143.xml