In Situ Testing of Flexible Electronics: Quantitative investigations of the interconnect. Issue 2 (April 2017)

• Record Type: Journal Article
• Authors: Gastaldi, Dario
• Is Part Of: Optik & Photonik. Volume 12:Issue 2(2017)
• Page Start: 34
• Page End: 36
• Publication Date: 2017-04
• Subjects: Optics -- Periodicals; Photonics -- Periodicals; 621.3605
• DOI: 10.1002/opph.201700007
• Languages: English
• ISSNs: 1863-1460

Abstract

Abstract: If you are looking for Peter Gips, Torben Becker, Ulrich Oechsner and Gregor Federau: Analyzing Filiform Corrosion, Optik Photonik 12(2), p. 40, April 2017, please click here: 10.1002/opph.201700008 . Quantitative information is central to the research and development efforts of flexible electronic devices. This article discusses the research of Dario Gastaldi and his group at the Politecnico di Milano, on how the flexible conductive connection between electrical components, known as 'the interconnect', has benefited from in situ mechanical testing coupled to the quantitative imaging capabilities of the LEXT OLS4100 and its specialized objectives, which has a design optimized for the 405 nm laser wavelength. The Gastaldi group has generated quantitative evidence to support how interconnect geometry determines device integrity under strain. Such information facilitates numerical modelling systems for optimising the design process. The evolution of crack formation is also followed in more detail, while it has also been shown that plasma treatment of polymer can be detrimental to device strength under strain.