Cite
HARVARD Citation
Lee, C. et al. (2015). Assembly reliability improvement of 3D-ICs packaging using pre-stuffed molding material. Vacuum. pp. 152-160. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Lee, C. et al. (2015). Assembly reliability improvement of 3D-ICs packaging using pre-stuffed molding material. Vacuum. pp. 152-160. [Online].