Self-assembled block copolymer micelles with silver–carbon nanotube hybrid fillers for high performance thermal conduction. Issue 5 (19th December 2014)

• Record Type: Journal Article
• Authors: Choi, Jae Ryung; Yu, Seunggun; Jung, Haejong; Hwang, Sun Kak; Kim, Richard Hahnkee; Song, Giyoung; Cho, Sung Hwan; Bae, Insung; Hong, Soon Man; Koo, Chong Min; Park, Cheolmin
• Is Part Of: Nanoscale. Volume 7:Issue 5(2015)
• Page Start: 1888
• Page End: 1895
• Publication Date: 2014-12-19
• Subjects: Nanoscience -- Periodicals; Nanotechnology -- Periodicals; 620.505
• DOI: 10.1039/c4nr06390b
• Languages: English
• ISSNs: 2040-3364

Abstract

Abstract : A novel, polymer-filled composite with thermal conductivity of 153 W m −1 K −1 was developed by the blending block copolymer micelles, MWNTs and deformable Ag particles. Abstract : The development of polymer-filled composites with an extremely high thermal conductivity (TC) that is competitive with conventional metals is in great demand due to their cost-effective process, light weight, and easy shape-forming capability. A novel polymer composite with a large thermal conductivity of 153 W m −1 K −1 was prepared based on self-assembled block copolymer micelles containing two different fillers of micron-sized silver particles and multi-walled carbon nanotubes. Simple mechanical mixing of the components followed by conventional thermal compression at a low processing temperature of 160 °C produced a novel composite with both structural and thermal stability that is durable for high temperature operation up to 150 °C as well as multiple heating and cooling cycles of Δ T = 100 °C. The high performance in thermal conduction of our composite was mainly attributed to the facile deformation of Ag particles during the mixing in a viscous thermoplastic medium, combined with networked carbon nanotubes uniformly dispersed in the nanoscale structural matrix of block copolymer micelles responsible for its high temperature mechanical stability. Furthermore, micro-imprinting on the composite allowed for topographically periodic surface micropatterns, which offers broader suitability for numerous micro-opto-electronic systems.