Fabrication of copper/single-walled carbon nanotube composite film with homogeneously dispersed nanotubes by electroless deposition. (June 2016)

• Record Type: Journal Article
• Authors: Arai, Susumu; Osaki, Takuma; Hirota, Mitsuhito; Uejima, Mitsugu
• Is Part Of: Materials today communications. Volume 7(2016)
• Page Start: 101
• Page End: 107
• Publication Date: 2016-06
• Subjects: Single-walled carbon nanotube -- Copper -- Composite -- Electroless deposition; Materials science -- Periodicals; 620.11
• DOI: 10.1016/j.mtcomm.2016.04.009
• Languages: English
• ISSNs: 2352-4928

Abstract

Abstract: Copper/single-walled carbon nanotube (SWCNT) composite films were fabricated by electroless deposition. The SWCNTs were formed using the water-assisted chemical vapor deposition method. To prepare copper/SWCNT composite plating baths with homogeneously dispersed SWCNTs, magnetic stirring, ultrasonic homogenization, and collision-type atomization were examined as mechanical methods for the disintegration of SWCNT bundles. Appropriate dispersants were added to the plating baths to avoid re-aggregation of the disintegrated SWCNTs. The degree of SWCNT dispersion in the copper/SWCNT composite plating bath was evaluated using a particle size analyzer, and the microstructures of the copper/SWCNT composite films were analyzed using scanning electron microscopy and X-ray diffraction. Collision-type atomization most significantly improved the degree of SWCNT dispersion in the composite plating bath. Using this treatment method, copper/SWCNT composite films with homogeneous dispersions of SWCNTs were successfully fabricated by electroless deposition.