Electrical, thermal and mechanical properties of poly-etherimide epoxy-diamine blend. (1st February 2017)
- Record Type:
- Journal Article
- Title:
- Electrical, thermal and mechanical properties of poly-etherimide epoxy-diamine blend. (1st February 2017)
- Main Title:
- Electrical, thermal and mechanical properties of poly-etherimide epoxy-diamine blend
- Authors:
- Halawani, N.
Augé, J.L.
Morel, H.
Gain, O.
Pruvost, S. - Abstract:
- Abstract: This work deals with the study of thermoset-thermoplastic blend forming an epoxy-amine/poly-etherimide phase separated to assess the dielectric and thermal performances. These materials would be good candidates to replace the passivation layer in semiconductors, particularly ones used as switches in power electronic applications. Polyimide and Parylene are usually quoted and studied. Mixtures based on polymers would be a novel candidate that can manage to be an insulator for the system. The modified and non-modified systems where characterized by transmission electron microscopy, scanning electron microscopy, differential scanning calorimetry, thermogravimetric analysis, dynamic mechanical analysis, dielectric analysis and analytical simulation was carried out on dielectric measurements. These complementary techniques were used first to investigate the presence of the phase separation phenomenon and second to quantify the separated nodules size. The effect of this phase separation was examined and showed enhancement in the dielectric values compared to the pure epoxy system. It was finally simulated to show a close assumption of what is found experimentally. Graphical abstract: Epoxy – polyetherimide, a homogenous phase separated blend, studied to show the effect of phase separation phenomenon in an organic-organic blend on the thermal, mechanical and electrical properties. The presence of the thermoplastic nodules decreased the permittivity values and theAbstract: This work deals with the study of thermoset-thermoplastic blend forming an epoxy-amine/poly-etherimide phase separated to assess the dielectric and thermal performances. These materials would be good candidates to replace the passivation layer in semiconductors, particularly ones used as switches in power electronic applications. Polyimide and Parylene are usually quoted and studied. Mixtures based on polymers would be a novel candidate that can manage to be an insulator for the system. The modified and non-modified systems where characterized by transmission electron microscopy, scanning electron microscopy, differential scanning calorimetry, thermogravimetric analysis, dynamic mechanical analysis, dielectric analysis and analytical simulation was carried out on dielectric measurements. These complementary techniques were used first to investigate the presence of the phase separation phenomenon and second to quantify the separated nodules size. The effect of this phase separation was examined and showed enhancement in the dielectric values compared to the pure epoxy system. It was finally simulated to show a close assumption of what is found experimentally. Graphical abstract: Epoxy – polyetherimide, a homogenous phase separated blend, studied to show the effect of phase separation phenomenon in an organic-organic blend on the thermal, mechanical and electrical properties. The presence of the thermoplastic nodules decreased the permittivity values and the simulation prediction showed similar results with a shift to higher values. … (more)
- Is Part Of:
- Composites. Number 110(2017)
- Journal:
- Composites
- Issue:
- Number 110(2017)
- Issue Display:
- Volume 110, Issue 110 (2017)
- Year:
- 2017
- Volume:
- 110
- Issue:
- 110
- Issue Sort Value:
- 2017-0110-0110-0000
- Page Start:
- 530
- Page End:
- 541
- Publication Date:
- 2017-02-01
- Subjects:
- Thermosetting resin -- Organic-organic blend -- Thermoplastic -- Electrical properties
Composite materials -- Periodicals
Materials science -- Periodicals
Composite materials
Periodicals
Electronic journals
620.118 - Journal URLs:
- http://www.sciencedirect.com/science/journal/13598368 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.compositesb.2016.11.022 ↗
- Languages:
- English
- ISSNs:
- 1359-8368
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 3365.620000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 278.xml