Glass Dielectrics in Extreme High‐Temperature Environment. Issue 12 (12th September 2016)

• Record Type: Journal Article
• Authors: Gao, Jun; Kwon, Do‐Kyun; Perini, Steven; Long, Jeffery; Zhang, Shihai; Lanagan, Michael T.
• Editors: Brennecka, G.
• Is Part Of: Journal of the American Ceramic Society. Volume 99:Issue 12(2016)
• Page Start: 4045
• Page End: 4049
• Publication Date: 2016-09-12
• Subjects: glass -- dielectric materials/properties -- polarization; Ceramics -- Periodicals; 620.1405
• DOI: 10.1111/jace.14424
• Languages: English
• ISSNs: 0002-7820

Abstract

Abstract : Thin and flexible glass ribbons can be rolled into a film capacitor structures for power electronic circuits. Glass has excellent electrical properties and is a leading candidate to replace polymer films for high‐temperature applications. The dielectric properties of a low‐alkali aluminoborosilicate glass were characterized up to temperatures of 400°C. Low‐field permittivity values of 6 with dielectric loss below 0.01 were found for temperatures below 300°C. The dielectric breakdown strength exceeded 5 MV/cm for temperature of 400°C and high‐field polarization measurements showed that glass has over 95% energy efficiency at temperatures of 200°C, which is a target temperature for high‐temperature power electronic circuits driven by wide bandgap semiconductor devices.