Flame retarding epoxy composites with poly(phosphazene-co-bisphenol A)-coated boron nitride to improve thermal conductivity and thermal stability. Issue 10 (18th January 2017)

• Record Type: Journal Article
• Authors: Qu, Taoguang; Yang, Na; Hou, Jun; Li, Guohua; Yao, Yanmei; Zhang, Qingxin; He, Lianqi; Wu, Dezhen; Qu, Xiongwei
• Is Part Of: RSC advances. Volume 7:Issue 10(2017)
• Page Start: 6140
• Page End: 6151
• Publication Date: 2017-01-18
• Subjects: Chemistry -- Periodicals; 540.5
• DOI: 10.1039/c6ra27062j
• Languages: English
• ISSNs: 2046-2069

Abstract

Abstract : A novel poly(cyclotriphosphazene- co -bisphenol A)-coated boron nitride (PCB-BN) was synthesized by in situ polymerization on the surface of BN. The epoxy/PCB-BN composites showed the enhanced thermal conductivity with the improved flame retardance. Abstract : Based on the template-induced self-assembly characteristic of cyclomatrix polyphosphazene micro–nanometer materials, novel poly(cyclotriphosphazene- co -bisphenol A)-coated boron nitride (PCB-BN) was designed and synthesized by in situ condensation polymerization on the surfaces of boron nitride (BN) particles using the reaction of hexachlorocyclotriphosphazene (HCCP) with bisphenol A (BPA). It was found that the incorporation of PCB-BN particles in the epoxy matrix significantly enhanced thermal conductivity of the epoxy composites. With 20 wt% PCB-BN loading, the thermal conductivity of the EP/PCB-BN composites was 0.708 W m −1 K −1, which was 3.7 times higher than that of the neat epoxy. Meanwhile, the EP/PCB-BN composites possessed good electrical insulation and thermal stability simultaneously. The composites fabricated also exhibited improved flame retardation and superior dimensional stability during combustion.