Application of a duplex diffusion layer model to pulse reverse plating. (2nd January 2017)

• Record Type: Journal Article
• Authors: Green, T. A.; Roy, S.
• Is Part Of: Transactions of the Institute of Metal Finishing. Volume 95:Number 1(2017)
• Page Start: 46
• Page End: 51
• Publication Date: 2017-01-02
• Subjects: Electrodeposition -- Pulse plating -- Diffusion layer -- Mass transfer; Metals -- Finishing -- Periodicals; Metals -- Surfaces -- Periodicals; Metallurgy -- Periodicals; 671.705
• DOI: 10.1080/00202967.2016.1214354
• Languages: English
• ISSNs: 0020-2967

Abstract

Abstract : The application of Ibl's duplex diffusion layer model to the analysis of mass transport in pulse reverse plating with bipolar current pulses has been investigated. Although originally proposed to describe normal pulse plating, Yin has recently extended Ibl's model to include pulse reverse plating. Using the expressions derived by Yin the pulse limiting current density was determined over a wide range of pulse plating conditions, and then compared to values calculated using more accurate numerical solutions. In general, there was good agreement between the two approaches which demonstrated the essential validity of Yin's extension to Ibl's original model. The simplified model is most accurate at long duty cycles, small dimensionless pulse times and for low values of the dimensionless pulse reverse current where its underlying assumptions are most likely to be valid. At very long dimensionless pulse times (i.e. T * > 1) the model becomes increasingly inaccurate and its use in these circumstances cannot be justified.