Application of robust color composite fringe in flip-chip solder bump 3-D measurement. (April 2017)

• Record Type: Journal Article
• Authors: Kuo, Chung-Feng Jeffrey; Wu, Han-Cheng
• Is Part Of: Optics and lasers in engineering. Volume 91(2017)
• Page Start: 261
• Page End: 269
• Publication Date: 2017-04
• Subjects: Optical inspection -- Fringe projection profilometry -- Color composite fringe -- Phase unwrapping; Lasers in engineering -- Periodicals; Optical measurements -- Periodicals; Optics -- Periodicals; Lasers en ingénierie -- Périodiques; Mesures optiques -- Périodiques; Optique -- Périodiques; 621.36605
• DOI: 10.1016/j.optlaseng.2016.12.003
• Languages: English
• ISSNs: 0143-8166

Abstract

Abstract: This study developed a 3-D measurement system based on flip-chip solder bump, used fringes with different modulation intensities in color channels, in order to produce color composite fringe with robustness, and proposed a multi-channel composite phase unwrapping algorithm, which uses fringe modulation weights of different channels to recombine the phase information for better measurement accuracy and stability. The experimental results showed that the average measurement accuracy is 0.43 μm and the standard deviation is 1.38 µm. The results thus proved that the proposed 3-D measurement system is effective in measuring a plane with a height of 50 μm. In the flip-chip solder bump measuring experiment, different fringe modulation configurations were tested to overcome the problem of reflective coefficient between the flip-chip base board and the solder bump. The proposed system has a good measurement results and robust stability in the solder bump measurement, and can be used for the measurement of 3-D information for micron flip-chip solder bump application. Highlights: Color composite fringe have different fringe modulation intensities in each channel. The proposed method could combine the phase information in each channel. Different fringe modulation to solve the reflective coefficient problem. The proposed method has high accuracy and stability in the flip-chip measurement.