Cite
HARVARD Citation
Wu, M. et al. (2016). Simulating surface tension of Sn-based lead free solder using an artificial neural network. Soldering & surface mount technology. 28 (4), pp. 201-206. [Online].
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Wu, M. et al. (2016). Simulating surface tension of Sn-based lead free solder using an artificial neural network. Soldering & surface mount technology. 28 (4), pp. 201-206. [Online].