3D package-integrated artificial magnetic conductor antenna arrays for 60 GHz transceivers. Issue 18 (11th December 2016)

• Record Type: Journal Article
• Authors: Kyriazidou, Chryssoula A.; Contopanagos, Harry; Yoon, Seunghwan; Papió Toda, Anna; De Flaviis, Franco; Castaneda, Jesus A.; Alexopoulos, Nicolaos G.
• Is Part Of: Journal of electromagnetic waves and applications. Volume 30:Issue 18(2016)
• Page Start: 2365
• Page End: 2389
• Publication Date: 2016-12-11
• Subjects: Artificial magnetic conductors -- directive antennas -- scanning arrays -- mm-wave technology -- array combiners -- in-package integration -- 60 GHz integrated arrays -- low-profile dipole antenna; Electromagnetic waves -- Periodicals; Electromagnetic devices -- Periodicals; 621.3
• DOI: 10.1080/09205071.2016.1250679
• Languages: English
• ISSNs: 0920-5071

Abstract

Abstract: We present a low-profile design of dipole antenna arrays integrated on a planar artificial magnetic conductor (AMC) based on spiral unit cells. The whole system is designed and manufactured on a multi-layer organic laminate packaging technology and can be integrated with a single-chip 60-GHz radio transceiver die. We analyze two fabricated arrays of different total area both of which contain 16 elements fed through a combiner network exciting the array elements either in phase or for 45° scan angle. The integrated antenna-AMC array element presented has twice the impedance bandwidth necessary to cover all international 60-GHz radio bands, small form factor suitable for on-package integration, and 5 dBi gain including all losses. The larger 16-element array, occupying 11 × 11 mm 2 package area, has a measured gain of 17 dBi at broadside and 15 dBi at 45° scan angle, while the smaller array, occupying a 6.6 × 11 mm 2 package area, has a gain of 15 dBi at broadside and 14 dBi at a 45° scan angle. These arrays are an ideal 3D-integrated package solution for 60 GHz radio transceivers.