Cite
HARVARD Citation
Ma, Y. et al. (2016). Thermoelectric properties of copper chalcogenide alloys deposited via the solution-phase using a thiol–amine solvent mixture. RSC advances. 6 (102), pp. 99905-99913. [Online].
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Ma, Y. et al. (2016). Thermoelectric properties of copper chalcogenide alloys deposited via the solution-phase using a thiol–amine solvent mixture. RSC advances. 6 (102), pp. 99905-99913. [Online].