Three-dimensional superhydrophobic copper 7, 7, 8, 8-tetracyanoquinodimethane biointerfaces with the capability of high adhesion of osteoblasts. Issue 6 (26th January 2016)

• Record Type: Journal Article
• Authors: Zhou, Jie; Fan, Jun-Bing; Nie, Qiong; Wang, Shutao
• Is Part Of: Nanoscale. Volume 8:Issue 6(2016)
• Page Start: 3264
• Page End: 3267
• Publication Date: 2016-01-26
• Subjects: Nanoscience -- Periodicals; Nanotechnology -- Periodicals; 620.505
• DOI: 10.1039/c5nr08305b
• Languages: English
• ISSNs: 2040-3364

Abstract

Abstract : A three-dimensional superhydrophobic copper 7, 7, 8, 8-tetracyanoquinodimethane (CuTCNQ) nanowire array with the capability of very high adhesion of osteoblasts was demonstrated. Abstract : A three-dimensional superhydrophobic copper 7, 7, 8, 8-tetracyanoquinodimethane (CuTCNQ) nanowire array with the capability of high adhesion of osteoblasts was demonstrated. The CuTCNQ nanowire array was constructed by using a combined vapor deposition technique. The superhydrophobic nanowire array exhibited very high adhesion of osteoblasts, indicating that the CuTCNQ nanowire array was a good biointerface.