Fabrication of 10 µm-scale conductive Cu patterns by selective laser sintering of Cu complex ink. (February 2017)

• Record Type: Journal Article
• Authors: Min, Hyungsuk; Lee, Byoungyoon; Jeong, Sooncheol; Lee, Myeongkyu
• Is Part Of: Optics & laser technology. Volume 88(2017)
• Page Start: 128
• Page End: 133
• Publication Date: 2017-02
• Subjects: Cu complex ink -- Selective laser sintering -- Patterning -- Metallization; Optics -- Periodicals; Lasers -- Periodicals; Electronic journals; 621.366
• DOI: 10.1016/j.optlastec.2016.09.021
• Languages: English
• ISSNs: 0030-3992

Abstract

Abstract: A Cu complex ink was synthesized using copper formate as a precursor and its potential for laser patterning was investigated. The Cu ink was spin-coated onto a substrate and the coated film was space-selectively sintered using a nanosecond-pulsed ultraviolet laser. The unexposed Cu ink could be removed from the film by rinsing it with the dispersing agent used to synthesize the ink, disclosing a conductive Cu pattern. A minimum resistivity of 8.46×10 −5 Ω cm was obtained for the Cu lines with 10–20 µm widths. The feasibility of this method for metallization was demonstrated by fabricating a complex Cu electric circuit on an indium tin oxide-coated glass substrate. The selective laser sintering approach provides a simple, cost-effective alternative to conventional lithography for the production of electrode or metallization patterns. Highlights: A Cu complex ink is synthesized using Cu formate as a precursor. Conductive Cu patterns are fabricated by selective laser sintering of the ink. A minimum line width of 12 µm is obtained.