Enhanced thermal conductive 3D-SiC/Al-Si-Mg interpenetrating composites fabricated by pressureless infiltration. Issue 2 (1st February 2017)

• Record Type: Journal Article
• Authors: Wang, Dongmei; Zheng, Zhixiang; Lv, Jun; Xu, Guangqing; Zhou, Shiang; Tang, Wenming; Wu, Yucheng
• Is Part Of: Ceramics international. Volume 43:Issue 2(2017)
• Page Start: 1755
• Page End: 1761
• Publication Date: 2017-02-01
• Subjects: High thermal conductivity -- Pressureless infiltration -- 3D-SiC/Al-Si-Mg interpenetrating composite; Ceramics -- Periodicals; Céramique industrielle -- Périodiques; Ceramics; Periodicals; Electronic journals; 666
• DOI: 10.1016/j.ceramint.2016.10.104
• Languages: English
• ISSNs: 0272-8842

Abstract

Abstract: A high thermal conductive 3D-SiC/Al-Si-Mg interpenetrating composite (IPC) with three dimensional mutually interpenetrated structure was fabricated by mold-forming and pressureless infiltration method. Al-15Si-10Mg was used as the infiltration aluminum alloy. The obtained composite was treated with a T6 procedure. The composed phases, microstructure, thermal conductivity, mechanical strength and fractography of the prepared 3D-SiC/Al-Si-Mg IPC were either analyzed or measured with X-ray diffraction (XRD), optical metallography, laser thermal conductivity instrument, universal testing machine, field emission electron scanning microscopy (SEM) with energy dispersive spectroscopy (EDS), high-resolution transmission electron microscopy (HRTEM), and etc. The results showed that both SiC ceramic and aluminum alloy phases distribute evenly and form a three-dimensional mutually interpenetrated structure in the obtained IPC. No clear brittle and harmful Al4 C3 phase was found in the composite. The obtained IPC contains a SiC volume fraction of 67 vol% and has the properties of a density of 3.02 g/cm 2, a thermal conductivity of 233.6 W/(m °C), a thermal expansion coefficient (RT~300 °C) of 7.03×10 −6 /°C and a bending strength of 288 MPa.