Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing. (January 2017)

• Record Type: Journal Article
• Authors: Zhao, Dewen; He, Yongyong; Wang, Tongqing; Lu, Xinchun
• Is Part Of: Tribology international. Volume 105(2017)
• Page Start: 37
• Page End: 41
• Publication Date: 2017-01
• Subjects: Chemical mechanical polishing -- Hydrodynamic lubrication -- Carrier structure -- Fluid pressure; Tribology -- Periodicals; 621.89
• DOI: 10.1016/j.triboint.2016.09.019
• Languages: English
• ISSNs: 0301-679X

Abstract

Abstract: In this study, a specially designed carrier with a one-zone pneumatic loading system that uses a thick copper disk as the workpiece was developed. Comparative studies of the fluid pressure and workpiece orientation between the disk and wafer carriers during chemical mechanical polishing were conducted. The results reveal that the copper disk leans down toward the leading edge and produces a negative-dominated (approximately 70%) fluid pressure, which differs from the multi-zone carrier but agrees with other studies in which the fluid pressure is measured from the disk side. Different balancing statuses and wedged gaps are formed in these two structures. Highlights: A special copper disk carrier was developed to do comparative studies for CMP. The fluid pressure and pitch angle were compared between the disk and wafer. The disk leans down toward the leading edge and forms negative fluid pressure. Different balancing statuses and wedged gaps are formed for the two structures. The results of the disk agree with other studies.