Cite
HARVARD Citation
Tsai, M. et al. (2016). Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications. Microelectronics and reliability. pp. 120-128. [Online].
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Tsai, M. et al. (2016). Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications. Microelectronics and reliability. pp. 120-128. [Online].