Non-uniform film growth and micro/macro-galvanic corrosion of copper in aqueous sulphide solutions containing chloride. (January 2017)

• Record Type: Journal Article
• Authors: Chen, J.; Qin, Z.; Martino, T.; Shoesmith, D.W.
• Is Part Of: Corrosion science. Volume 114(2017)
• Page Start: 72
• Page End: 78
• Publication Date: 2017-01
• Subjects: A. Copper -- B. SEM -- C. Interfaces; Corrosion and anti-corrosives -- Periodicals; 620.11223
• DOI: 10.1016/j.corsci.2016.10.024
• Languages: English
• ISSNs: 0010-938X

Abstract

Highlights: Sulphide crystal formed on Cu experiences excessive growth in sulphide solutions. Cu is mobile in aqueous sulphide solutions during the growth of sulphide film. Excessive crystal growth mechanism was proposed. Abstract: The corrosion of copper in aqueous sulphide environments is rapid and can occur under transport limited conditions. At sufficiently high sulphide flux, microgalvanic corrosion can be supported between areas of the surface covered by compact sulphide deposits and other areas covered only by a porous deposit. This leads to excessive crystal growth at the cathodes (compact film) and localized corrosion damage at the anodes (porous film). The transport of Cu(I) between the two areas, required to sustain this process, appears to occur predominantly by the solution transport of Cu-sulphide complex or clusters.