Microstructure and mechanical properties of Pb-free Sn–3.0Ag–0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process. (15th January 2016)

• Record Type: Journal Article
• Authors: Chellvarajoo, Srivalli; Abdullah, M.Z.
• Is Part Of: Materials & design. Volume 90(2016)
• Page Start: 499
• Page End: 507
• Publication Date: 2016-01-15
• Subjects: NiO nanoparticle -- Lead-free SAC 305 -- Intermetallic -- Mechanical property -- Reflow soldering process; Materials -- Periodicals; Engineering design -- Periodicals; Matériaux -- Périodiques; Conception technique -- Périodiques; Electronic journals; 620.11
• DOI: 10.1016/j.matdes.2015.10.142
• Languages: English
• ISSNs: 0264-1275

Abstract

Abstract: Incorporating various types of ceramic type nanoparticles into Pb-free solder pastes produces unique nanocomposite solder pastes. In this study, Sn–Ag–Cu (SAC) 305 solder alloys were mixed with 0.5, 1.5, and 2.5 wt.% NiO ceramic nano-elements to produce a new set of nanocomposite solder pastes. The displacement phenomenon of NiO nanoparticles during reflow soldering process may contribute efficient idea in the field of microelectronic industries. The reinforcement of reactive nanoparticles in SAC 305 solder paste caused 50% changes in the intermetallic layer thickness and hardness of plain solder. Top-view microstructural analysis wherein dimple surfaces were magnified showed that the combination of SAC 305–2.5 wt.% NiO nanopaste exceeded the limits of alloy addition. Graphical abstract: Scenario of IMCs formation for Sn–3.0 wt.% Ag–0.5 wt.% Cu–x wt.% NiO nanocomposite solder paste during reflow soldering process. Highlights: NiO nanoparticles was added into Sn–3.0Ag–0.5Cu solder paste by mechanical mixing to form nanocomposite solder paste. The addition of nanoparticles into solder paste significantly reduced the intermetallics compound thickness. The hardness of nanocomposite solder exceeds 50% from reference solder after reflow soldering process.