Cite
HARVARD Citation
Auersperg, J. et al. (2016). Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor. Microelectronics and reliability. pp. 665-668. [Online].
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Auersperg, J. et al. (2016). Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor. Microelectronics and reliability. pp. 665-668. [Online].