Characterization and modeling of three-dimensional self-healing shape memory alloy-reinforced metal-matrix composites. (December 2016)

• Record Type: Journal Article
• Authors: Zhu, Pingping; Cui, Zhiwei; Kesler, Michael S.; Newman, John A.; Manuel, Michele V.; Wright, M. Clara; Brinson, L. Catherine
• Is Part Of: Mechanics of materials. Volume 103(2016:Dec.)
• Page Start: 1
• Page End: 10
• Publication Date: 2016-12
• Subjects: Crack closure -- Phase transformation -- Pre-strain -- Finite element model -- Digital image correlation; Strength of materials -- Periodicals; Mechanics, Applied -- Periodicals; Résistance des matériaux -- Périodiques; Mécanique appliquée -- Périodiques; Mechanics, Applied; Strength of materials; Periodicals; Electronic journals; 620.11
• DOI: 10.1016/j.mechmat.2016.09.005
• Languages: English
• ISSNs: 0167-6636

Abstract

Abstract: In this work, three-dimensional metal-matrix composites (MMCs) reinforced by shape memory alloy (SMA) wires are modeled and simulated, by adopting an SMA constitutive model accounting for elastic deformation, phase transformation and plastic behavior. A modeling method to create composites with pre-strained SMA wires is also proposed to improve the self-healing ability. Experimental validation is provided with a composite under three-point bending. This modeling method is applied in a series of finite element simulations to investigate the self-healing effects in pre-cracked composites, especially the role of the SMA reinforcement, the softening property of the matrix, and the effect of pre-strain in the SMA. The results demonstrate that SMA reinforcements provide stronger shape recovery ability than other, non-transforming materials. The softening property of the metallic matrix and the pre-strain in SMA are also beneficial to help crack closure and healing. This modeling approach can serve as an efficient tool to design SMA-reinforced MMCs with optimal self-healing properties that have potential applications in components needing a high level of reliability.