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HARVARD Citation
Bahman, A. et al. (2016). Mission-profile-based stress analysis of bond-wires in SiC power modules. Microelectronics and reliability. pp. 419-424. [Online].
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Bahman, A. et al. (2016). Mission-profile-based stress analysis of bond-wires in SiC power modules. Microelectronics and reliability. pp. 419-424. [Online].