Wetting and spreading kinetics of liquid Sn on Ag and Ag3Sn substrates. (15th January 2017)

• Record Type: Journal Article
• Authors: Liashenko, O.Y.; Hodaj, F.
• Is Part Of: Scripta materialia. Volume 127(2017)
• Page Start: 24
• Page End: 28
• Publication Date: 2017-01-15
• Subjects: Wetting -- Kinetics -- Interfaces -- Soldering -- Ag3Sn; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2016.08.035
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract: The isothermal wetting and spreading of liquid Sn on Ag and Ag3 Sn substrates are studied for the first time using the dispensed drop technique under high vacuum at 300° and 400 °C. The Sn/Ag3 Sn interaction involves only dissolution of Ag3 Sn in the molten phase while the Sn/Ag interaction involves both dissolution of Ag and Ag3 Sn formation at the interface. Only one spreading regime is observed in Sn/Ag3 Sn system and two spreading regimes in Sn/Ag system. The contact angles of liquid Sn on Ag and Ag3 Sn substrates are evaluated and a mechanism of reactive spreading in the liquid Sn/Ag system is proposed. Graphical abstract: