Cite
HARVARD Citation
Guo, F. et al. (2016). Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration. Journal of materials research. 31 (12), pp. 1793-1800. [Online].
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Guo, F. et al. (2016). Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration. Journal of materials research. 31 (12), pp. 1793-1800. [Online].