Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface Modification. Issue 1 (2016)

• Record Type: Journal Article
• Authors: Joshi, Shivani; Loon, Antonie van; Savov, Angel; Dekker, Ronald
• Is Part Of: MRS advances. Volume 1:Issue 1(2016)
• Page Start: 33
• Page End: 38
• Publication Date: 2016
• Subjects: polymer, -- adhesion, -- sputtering; Electrical engineering -- Congresses; Physics -- Congresses; Materials -- Research -- Congresses; Materials science -- Congresses; 620.11
• DOI: 10.1557/adv.2016.56
• Languages: English
• ISSNs: 2059-8521

Abstract

ABSTRACT: Silicon wafers coated with a 5μm thick layer of polyimide were treated with different surface modification techniques such as chemical adhesion promoters, oxygen plasma and an Ar + sputter etch. After surface modification, the wafers were molded with a 1mm thick layer of PDMS. The adhesion of the PDMS was tested by peel testing and by using a Nordson DAGE wedge shear tester. It was found that commercially available chemical adhesion promoters and oxygen plasma treatment resulted in a very poor PI/PDMS adhesion, whereas the Ar + sputter etch resulted in an adhesion so strong that the PDMS could not be delaminated from the PI surface without the failure of the material.