Thermal Runaway in Mold‐Assisted Flash Sintering. Issue 9 (28th July 2016)

• Record Type: Journal Article
• Authors: Dong, Yanhao; Chen, I.‐Wei
• Editors: Olevsky, E.
• Is Part Of: Journal of the American Ceramic Society. Volume 99:Issue 9(2016)
• Page Start: 2889
• Page End: 2894
• Publication Date: 2016-07-28
• Subjects: flash sintering -- joule heating -- SPS -- SiC -- electrical conductivity; Ceramics -- Periodicals; 620.1405
• DOI: 10.1111/jace.14413
• Languages: English
• ISSNs: 0002-7820

Abstract

Abstract : Analyzing the temperature evolution in pressureless mold‐assisted flash sintering, we found the same onset condition as in standard flash sintering: When sample's DC or AC Joule heating replaces environment's radiation heating as the dominant power input term, thermal runaway ensues. Various serial and parallel components connected to the sample, including the mold, insulation, and punches, can affect Joule heating and conduction heat loss, thus play an important role in successful mold‐assisted flash sintering.