Microstructure evolution and mechanical properties of transient liquid phase bonded Ti–6Al–4V joint with copper interlayer. (15th February 2016)

• Record Type: Journal Article
• Authors: Deng, Yongqiang; Sheng, Guangmin; Wang, Fangli; Yuan, Xinjian; An, Qi
• Is Part Of: Materials & design. Volume 92(2016)
• Page Start: 1
• Page End: 7
• Publication Date: 2016-02-15
• Subjects: Ti–6Al–4V -- Copper interlayer -- Transient liquid phase bonding -- Microstructure -- Mechanical properties; Materials -- Periodicals; Engineering design -- Periodicals; Matériaux -- Périodiques; Conception technique -- Périodiques; Electronic journals; 620.11
• DOI: 10.1016/j.matdes.2015.11.103
• Languages: English
• ISSNs: 0264-1275

Abstract

Abstract: The microstructure evolution and mechanical properties of transient liquid phase bonded Ti–6Al–4V joint with copper interlayer was investigated by varying the bonding time at 930 °C. It was revealed that intensive metallurgical reactions occurred at the Ti–6Al–4V/Cu interface and integral joint consisting of TiCu, Ti2 Cu layers and eutectoid structure was obtained for a bonding duration of 1 min. Prolonged holding time resulted in transformation of TiCu into Ti2 Cu and subsequently progressive decomposition of the Ti2 Cu phase. Ultimately, homogenized joint primarily composed of α-Ti matrix with tiny Ti2 Cu platelets was obtained when bonding for 30 min. Tensile tests demonstrated that the homogenized joint exhibited mechanical properties comparable with that of the Ti–6Al–4V parent alloy. These experimental results demonstrate that the transient liquid phase bonding technique employing Cu interlayer is of great potential to be used for joining titanium based alloys. Graphical abstract: Highlights: A low cost transient liquid phase bonding technique of Ti–6Al–4V was developed. Bonding strength comparable with Ti–6Al–4V base metal was achieved. Correlation between microstructure and strength of the bonded joints was elucidated. Lower temperature combining longer bonding time is preferred for joining Ti–6Al–4V.