Polyimide complexes with high dielectric performance: toward polymer film capacitor applications. Issue 27 (23rd June 2016)

• Record Type: Journal Article
• Authors: Peng, Xinwen; Xu, Wenhui; Chen, Linlin; Ding, Yichun; Chen, Shuiliang; Wang, Xiaoyan; Hou, Haoqing
• Is Part Of: Journal of materials chemistry. Volume 4:Issue 27(2016)
• Page Start: 6452
• Page End: 6456
• Publication Date: 2016-06-23
• Subjects: Materials -- Periodicals; Chemistry, Analytic -- Periodicals; Optical materials -- Research -- Periodicals; Electronics -- Materials -- Research -- Periodicals; 543.0284
• DOI: 10.1039/c6tc01304j
• Languages: English
• ISSNs: 2050-7526

Abstract

Abstract : Novel polyimide–copper complexes (PICuCs) were prepared by polymerization, complexation and imidization of a newly synthesized bipyridine-containing diamine monomer. They showed high dielectric performance, and excellent mechanical and thermal properties. Abstract : Novel polyimide–copper complexes (PICuCs) with a high dielectric constant of up to 133 were prepared by polymerization, complexation and imidization of a newly synthesized bipyridine-containing diamine monomer. The PICuCs showed high dielectric constant because of the enhanced electronic depolarization. Moreover, the PICuCs presented better mechanical and thermal properties than neat PI, which are promising materials for polymer film capacitors.