Influence of the grain boundary chemistry on the intergranular corrosion mechanisms of a high‐strength Al‐Mg‐Si alloy. (28th September 2015)

• Record Type: Journal Article
• Authors: Schnatterer, Christian; Zander, Daniela
• Other Names: Terryn Herman guestEditor.
• Is Part Of: Surface and interface analysis. Volume 48:Number 8(2016)
• Page Start: 750
• Page End: 754
• Publication Date: 2015-09-28
• Subjects: intergranular corrosion -- pitting corrosion -- grain boundary -- depletion; Surfaces (Physics) -- Periodicals; Surface chemistry -- Periodicals; Thin films -- Periodicals; 541.33
• DOI: 10.1002/sia.5859
• Languages: English
• ISSNs: 0142-2421

Abstract

Abstract : The influence of solution annealing (T4) and artificial aging (T6) on the corrosion properties of a technical Al‐Mg‐Si alloy was investigated. In the T4 condition, the material was not susceptible to intergranular corrosion; however, pitting was identified to occur. Subsequent artificial aging of the solution annealed and quenched alloys introduced susceptibility to intergranular corrosion. This phenomenon was attributed to two microgalvanic coupling situations: one that occurred between the noble Cu‐phases located on the grain boundary and the anodic adjacent area and one between a Mg‐ and Si‐depleted zone along the grain boundaries and the adjacent area. Pitting corrosion was proposed to occur as a result of the absence of these microgalvanic coupling situations, and therefore with the absence of a distinct, preexisting corrosion path in the solution annealed condition. Copyright © 2015 John Wiley & Sons, Ltd.