Fabrication of modified bismaleimide resins by hyperbranched phenyl polysiloxane and improvement of their thermal conductivities. Issue 62 (14th June 2016)

• Record Type: Journal Article
• Authors: Gu, Junwei; Liang, Chaobo; Dang, Jing; Meng, Xudong; Tang, Lin; Li, Yang; Zhang, Qiuyu
• Is Part Of: RSC advances. Volume 6:Issue 62(2016)
• Page Start: 57357
• Page End: 57362
• Publication Date: 2016-06-14
• Subjects: Chemistry -- Periodicals; 540.5
• DOI: 10.1039/c6ra10397a
• Languages: English
• ISSNs: 2046-2069

Abstract

Abstract : Synthetic terminal amine group hyperbranched phenyl polysiloxane (NH2 -HBPSi) is introduced into a bismaleimide/diallylbisphenol A (BMI/DABA) prepolymer to fabricate NH2 -HBPSi/BMI/DABA resins. Abstract : Synthetic terminal amine group hyperbranched phenyl polysiloxane (NH2 -HBPSi) is introduced into a bismaleimide/diallylbisphenol A (BMI/DABA) prepolymer to fabricate NH2 -HBPSi/BMI/DABA resins. Furthermore, functionalized silicon carbide particle/silicon carbide whisker (fSiCp/fSiCw) hybrid fillers are also used to fabricate fSiCp/fSiCw/NH2 -HBPSi/BMI/DABA thermal conductivity composites. A NH2 -HBPSi/BMI/DABA resin with 20 wt% NH2 -HBPSi is an ideal dielectric material with excellent impact strength and outstanding thermal stability, the corresponding dielectric constant ( ε ) is 3.12, dielectric loss (tan δ ) is 0.0098, impact strength value is 18.7 kJ m −2, glass transition temperature ( T g ) value is 281 °C and the 5 wt% thermal weight loss temperature ( T 5 ) value is 424 °C. The thermal conductivities of the fSiCp/fSiCw/BMI/DABA and fSiCp/fSiCw/NH2 -HBPSi/BMI/DABA composites are both increased with the increasing mass fraction of fSiCp/fSiCw hybrid fillers.