Cite
HARVARD Citation
Cheng, W. et al. (n.d.). A novel lumped‐parameter model of crosstalk between vias in high‐speed PCBS. Microwave and optical technology letters. 58 (9), pp. 2088-2090. [Online].
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Cheng, W. et al. (n.d.). A novel lumped‐parameter model of crosstalk between vias in high‐speed PCBS. Microwave and optical technology letters. 58 (9), pp. 2088-2090. [Online].