Bias influence on titanium interlayer for titanium nitride films. (2nd April 2016)

• Record Type: Journal Article
• Authors: Lain, G. C.; Cemin, F.; Menezes, C. M.; Aguzzoli, C.; Baumvol, I. J. R.; Tomiello, S. S.; Figueroa, C. A.
• Is Part Of: Surface engineering. Volume 32:Number 4(2016)
• Page Start: 279
• Page End: 283
• Publication Date: 2016-04-02
• Subjects: Voltage bias -- Ti interlayer -- Oxygen content -- TiN -- Cathodic arc -- Scratch resistance; Surfaces (Technology) -- Periodicals; Coatings -- Periodicals; 620.4405
• DOI: 10.1179/1743294415Y.0000000097
• Languages: English
• ISSNs: 0267-0844

Abstract

Abstract : This work investigates the deposition of TiN thin films by cathodic arc evaporation on stainless steel AISI 304 substrate for decorative applications. The applied voltage bias on the substrate during the Ti interlayer deposition was varied, and several properties were determined. The chemical profile, crystalline structure and microstructural properties were analysed by glow discharge optical emission spectroscopy, glancing angle X-ray diffraction and SEM techniques respectively. In addition, nanoindentation and sliding tests were performed in order to evaluate the hardness and scratch resistance of TiN thin films. The results showed that the applied voltage bias during the Ti interlayer deposition step could modify some properties of the TiN thin films. Indeed, lower oxygen contents and higher critical loads to start a plastic deformation (scratch resistance) of the TiN thin films are achieved at higher applied voltage biases during the Ti interlayer deposition. A higher scratch resistance is capable of imparting a long term durability of metallic pieces for decorative applications.