Cite
HARVARD Citation
Zhou, P. et al. (n.d.). A load identification method for the grinding damage induced stress (GDIS) distribution in silicon wafers. International journal of machine tools & manufacture. pp. 1-7. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Zhou, P. et al. (n.d.). A load identification method for the grinding damage induced stress (GDIS) distribution in silicon wafers. International journal of machine tools & manufacture. pp. 1-7. [Online].