Mechanical stress and stress release channels in 10–350 nm palladium hydrogen thin films with different micro-structures. (1st August 2016)

• Record Type: Journal Article
• Authors: Wagner, Stefan; Kramer, Thilo; Uchida, Helmut; Dobron, Patrik; Cizek, Jakub; Pundt, Astrid
• Is Part Of: Acta materialia. Volume 114(2016)
• Page Start: 116
• Page End: 125
• Publication Date: 2016-08-01
• Subjects: Stress -- Elastic constants -- Stress relaxation -- Acoustic emission -- Thin films; Materials -- Periodicals; Materials science -- Periodicals; Materials -- Mechanical properties -- Periodicals; Metallurgy -- Periodicals; Chemistry, Inorganic -- Periodicals; 620.112
• DOI: 10.1016/j.actamat.2016.05.023
• Languages: English
• ISSNs: 1359-6454

Abstract

Abstract: For thin metal films adhered to rigid substrates hydrogen uptake results in compressive stresses in the GPa range. Stresses affect the thermodynamics as well as the durability of thin films, but many films can release stress above critical stress values. Depending on the films' thickness, microstructure and adhesion to the substrate, which determine the energy available in the nano-sized system, stress release is conducted via different release mechanisms. To evaluate the different mechanisms, Palladium thin films ranging from 10 nm to 350 nm and with three different types of microstructures (nanocrystalline, multi-oriented epitaxy and three-fold epitaxy) are studied with special focus on the mechanical stress. In-situ substrate curvature measurements, XRD stress analyses and acoustic emission (AE) measurements are conducted to determine intrinsic stresses, hydrogen-induced stress changes and stress release signals. By this complementary experimental approach, different stress release mechanisms (named channels) are identified. Discrete stress relaxation (DSR) events are found already within the overall linear elastic stress-strain regime. Energies to stimulate DSRs lay well below the formation energy of dislocations, and may allow the movement of defects pre-existing in the films. For higher strain energies, all studied films can release stress by the formation of new dislocations and plastic deformation. When the adhesion to the substrate is small, an alternative release channel of film buckling opens for thick films.