Cite
HARVARD Citation
Shen, Y. et al. (2016). Numerical study of microbump failure in 3D microelectronic structures. Microelectronics and reliability. pp. 48-55. [Online].
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Shen, Y. et al. (2016). Numerical study of microbump failure in 3D microelectronic structures. Microelectronics and reliability. pp. 48-55. [Online].