Cite
HARVARD Citation
Jung, M. et al. (2016). A cross layer approach for efficient thermal management in 3D stacked SoCs. Microelectronics and reliability. pp. 43-47. [Online].
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Jung, M. et al. (2016). A cross layer approach for efficient thermal management in 3D stacked SoCs. Microelectronics and reliability. pp. 43-47. [Online].