Interplay between bond breaking and plasticity during fracture at a nanomolecularly-modified metal-ceramic interface. (August 2016)

• Record Type: Journal Article
• Authors: Kwan, Matthew; Braccini, Muriel; Jain, Ashutosh; Lane, Michael W.; Ramanath, Ganpati
• Is Part Of: Scripta materialia. Volume 121(2016)
• Page Start: 42
• Page End: 44
• Publication Date: 2016-08
• Subjects: Fracture -- Plasticity -- Interfaces -- Self-assembly -- Organosilane; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2016.04.034
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract: We reveal the roles of moisture and temperature on the interplay between interfacial work of adhesion γa and metal plasticity γp for copper-silica interfaces modified with an organosilane nanolayer. We find that γp ≠ 0 for interfaces with metal thicknesses hCu > 12 nm, and increases with hCu before it saturates at hCu ~ 165 nm. For a fixed hCu, γp increases due to temperature-induced yield stress decrease despite a decrease in γa with temperature because of water-induced siloxane bond weakening. These findings should be valuable for understanding the fracture mechanics of, and designing, nanomolecularly-functionalized interfaces subject to thermomechanical and chemical stresses. Graphical abstract: